Hysol
® H4200
Email| Hysol
® H4200
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| Methacrylate Adhesive | |
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Description Dexter Hysol H4200 is a non-sag, two component, room temperature curing, 10:1 mix ratio, methacrylate adhesive system. H4200 is formulated to yield high peel and shear strength. This adhesive forms resilient bonds and maintains its strength over a wide range of temperatures. H4200 is suitable for bonding a variety of substrates with a minimum of surface preparation. Recommended Substrates: PVC, polycarbonate, acrylic, aluminum, ABS, stainless steel and FRP Features Non-sagging gaps filled to .375 inch Superior impact and peel strength Little or no surface preparation Offers excellent tolerance to off-ratio mixing Rapid room temperature cure100% reactive Excellent environmental resistance Typical Cured Properties Tensile Strength (psi) 2,500 – 2,700 ASTM D 638 Tensile Elongation (%) 40 – 50 ASTM D 638 Peel Strength (pli) 40 ASTM D 3167 Tensile Lap Shear @ 77oF 3,700 – 3,900 ASTM D 1002 Tensile Lap Shear @ 180oF 1,900 – 2,100 ASTM D 1002 Shore D Hardness 75 – 80 Bondline Thickness (inches) .005 - .375 Typical Uncured Properties Part A Part B Mixed Open Time@ 77oF - - 4 – 6 minutes Fixture Time @ 180oF - - 15 – 20 minutes Color Cream Tan Pale Yellow Viscosity, cps 90,000 – 100,000 40,000 –50,000 - Brookfield HBT Spdl 6 @ 10 rpm Spdl 6 @ 10rpm - Specific Gravity 1.07 1.06 1.07 Ponds per gallon 8.92 8.83 8.91 Mix Ratio By Weight 10 1 - By Volume 10 1 - Performance Handling and Application Mixing: It is highly recommended that either meter mix equipment or cartridges with static mix nozzles be used to properly ratio and dispense the adhesive. For hand mixing, combine Part A and Part B in the correct ratio and mix thoroughly. Once mixed, H4200 should achieve a uniform color. This is important! Heat buildup during and after mixing is normal. To reduce the likelihood of exothermic reaction or excessive heat buildup, mix less than 100 grams at a time. Mixing smaller amounts will minimize heat buildup. Applying: Bonding surfaces should be clean, dry, and free of contamination. Extensive surface preparation is not required for H4200, and good bonds can be formed on most substrates after a solvent wipe. To assure maximum bond strength, surfaces must be mated within the adhesive's open time. Use enough material to completely fill the joint when parts are clamped. Curing: Parts should remain undisturbed during the interval of time between the material's open time and fixture time. After the fixture time is achieved the material has reached handling strength. Temperature below 55°F will slow the cure; above 85°F will accelerate cure rate. Clean Up: It is important to clean up excess adhesive from work area and application equipment before it hardens. Denatured alcohol and many common industrial solvents are suitable for removing uncured adhesive. Hysol H4200 is flammable. Keep containers tightly closed after use. Keep away from heat, sparks, and open flames. Storage Hysol adhesives should be stored in a cool, dry place when not used for a long period of time. The shelf life for H4200 is one year from date of manufacture when stored at 40oF and six months when stored at room temperature or 77oF. Exposure above room temperature will reduce shelf life. Packaging 490ml EPS cartridges 5 Gallon Pails 55 Gallon Drums |
DISCLAIMER: The information supplied in this document is for guidance only and should not be construed as a warranty. All implied warranties are expressly disclaimed. Including without limitation any warranty of merchantability and fitness for use: All users of the materials are responsible for assuring that it is suitable for their needs, environment and use. All data is subject to change as Dexter deems |
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