|
Multicore® Solder & Flux Materials
Multicore® No-Clean Fluxes Application: Spray/Foam
Multicore® Water Wash Fluxes-IPA Based
Multicore® Cored Wire
Multicore® Cleaners
Loctite® Brand Chipbonder® Syringe Dispense Adhesives
Thermal Management Adhesives
MultiCore® Solder a nd Flux
Material
The Multicore® line of solder
pastes and fluxes are designed to meet the rigorous demands of a variety of
electronic manufacturing soldering processes. Whether your process
requires long abandon times, wide process windows, or high-speed printing, we have a Multicore® solder and plus material to
suit your needs.
Multicore® Solder & Flux Materials For more information or to order Call
1-800-323-5158
MP200 Solder Paste WIDE PROCESS WINDOW
A high activity, soft, colorless,
low residue, no clean , solder paste that exhibits excellent print definition
with long open and abandon time.
Alloy: 6N62/SN63 63S4 Anti-Tombstoning
% Metal Load 90 90.5 Tack: (G../MM2) 1.1 Print Speed 25-200
CR36™ No Clean Solder Paste
HIGHEST ACTIVITY OFFERING A high activity colorless
residue paste. Exhibits good abandon time, long stencil life and minimum hot
slump.
Alloy: 6N62/SN63
% Metal Load 89.5 Tack: (G../MM2) 13-16 Print Speed 20-200
LF320™ Lead Free Paste WIDE PROCESS WINDOW A no clean flux system specially
formulated for Pb-free alloys.High temperature tolerance and wide printing
capability.
Alloy: 96SC
% Metal Load 88 Tack: (G../MM2) 1.2 Print Speed 20-150
WS200™ Water Wash Paste WIDE PROCESS WINDOW High performance water washable
solder paste. Residues are readly removed with D1 Water, without the need for a
saponifier.
Alloy: SN62/SN63
% Metal Load 90.5 Tack: (G../MM2) 0.8 Print Speed 25-100
Multicore® No-Clean Fluxes Application: Spray/Foam
X32-10™ No-Clean Flux
- Clear Residue Wide Process Window A general pupose
halide-free low solids flux which leaves clean, dry boards after wave soldering.
Suitable for foam and spray flux application systems.
% Solids: 2.2 % Halides: Zero Acid Value: 15.3 IPC Class: REMO
MF200™ Liquid Flux -
Contract Manufacturing Grade-Lead-Free Compatible A general
purpose halide-free flux with sustained activity to extend flux life in dual
wave and PB-free wave soldering applications. Suitable for spray flux
application systems. Solvent-based flux may be thinned with IPA.
% Solids: 6.4 % Halides: Zero Acid Value: 48.5 IPC Class: ORMO
MF300™ VOC-Free-Clear Residue-Resin-Lead-Free Compatible General purpose
VOC-Free (water based), no clean, halide free and resin free flux with special
formulation to minimize solder balling. Compatible with Pb-free processes. %
Solids: 4.6% Halides: Zero Acid Value: 37 IPC Class: ORMO
MRF301™ IPA-Based Rosin Flux-Lead-Free Compatible Higher solids flux for better
wetting on reduced solderability surfaces and to minimize bridging on complex
geometries. Fully Bp-Free and dual wave compatible. Solvent based flux may be
thinned with IPA. % Solids: 6.5 % Halides: Zero Acid Value: 41 IPC Class: ROMO
Multicore® Water Wash Fluxes-IPA Based
Hydro-X/20™ High Activity Flux A high activity water washable flux designed for
the soldering of the most difficult electronic assemblies. Unique activator
package enables a wider process window and the soldering of all common
electronic surfaces with ease.Residues are readily and completely removed by
water wash after soldering. Suitable for lead-free wave soldering.
% Solids: 20 % Halides: 1.0 Acid Value: 24
Multicore® Cored Wire
Multicore® Cored Wire Typical wire diameters are 0.015, 0.024, 0.032. 0.040, and
0.064 In
400™ Halide-free, no clean, clear residue, increased flux content for improved
wetting. Halide Content: Zero
502™ No clean, clear residue, minimal activation for increased wetting. Halide
Content: 0.2%
Hydro-X™
High Activity water washable. Halide Content: 3%
Multicore® Cleaners
Pozone™ SCO1™
Designed for
the stencil cleaning and hand cleaning of process soldering residues. Highly
effective cleaner that dries rapidy.
Loctite® Brand Chipbonder® Syringe
Dispense Adhesives
Cornerbond 3515™ Specially formulated to
allow component realignment in double sided reflow applications.
Color: Black Cure:In solid paste reflow cycle after paste has reached
liquidation. Process Method: Syringe Dispense Self-Alignment
Storage: (Protect from heat 5C- + 3C Shelf Life: 6 months DOM Syringe Size: 30
ml STD
3621™
High performance for ultra high-speed
syringe dispense. Good green strength. Superior humidity resisdtance and
electrical properties. Can be used in lead-free solder applications.Room
temperature storage capable.
Color: Red Cure: 90 sec. @ 150C or 2-3 min @ 125C Process Method: Very high
speed Syringe Dispensing - 47,000 DPH capable Jettable
Storage: (Protect from heat 5C- + 3C or 8C-21C for 30 days Shelf Life: 10 months
DOM Syringe Size: 10 and 30 ml STD, 30 ml Iwashita Clear syringe, 20 ml Panasert
syringe, 30 ml Fuji syringe.
For more information and/or to
order call 1-800-323-5158
or Contact
http://www.gluguru.com/help.htm
| 
The Glu
Guru™
Adhesive Tech Center
